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(2015). Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI. In <i>2015 IEEE International Symposium on Circuits and Systems (ISCAS)</i> (pp. 1925–1928). Lisbon, Portugal: IEEE. <a href=\"https://doi.org/10.1109/ISCAS.2015.7169049\">https://doi.org/10.1109/ISCAS.2015.7169049</a>","alphadin":"<span style=\"font-variant:small-caps;\">Sievers, Gregor</span> ; <span style=\"font-variant:small-caps;\">Ax, Johannes</span> ; <span style=\"font-variant:small-caps;\">Kucza, Nils</span> ; <span style=\"font-variant:small-caps;\">Flaskamp, Martin</span> ; <span style=\"font-variant:small-caps;\">Jungeblut, Thorsten</span> ; <span style=\"font-variant:small-caps;\">Kelly, Wayne</span> ; <span style=\"font-variant:small-caps;\">Porrmann, Mario</span> ; <span style=\"font-variant:small-caps;\">Rückert, Ulrich</span>: Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI. In: <i>2015 IEEE International Symposium on Circuits and Systems (ISCAS)</i> : IEEE, 2015, S. 1925–1928","ieee":"G. Sievers <i>et al.</i>, “Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI,” in <i>2015 IEEE International Symposium on Circuits and Systems (ISCAS)</i>, Lisbon, Portugal, 2015, pp. 1925–1928.","ama":"Sievers G, Ax J, Kucza N, et al. Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI. In: <i>2015 IEEE International Symposium on Circuits and Systems (ISCAS)</i>. IEEE; 2015:1925-1928. doi:<a href=\"https://doi.org/10.1109/ISCAS.2015.7169049\">10.1109/ISCAS.2015.7169049</a>","mla":"Sievers, Gregor, et al. “Evaluation of Interconnect Fabrics for an Embedded MPSoC in 28 Nm FD-SOI.” <i>2015 IEEE International Symposium on Circuits and Systems (ISCAS)</i>, IEEE, 2015, pp. 1925–28, doi:<a href=\"https://doi.org/10.1109/ISCAS.2015.7169049\">10.1109/ISCAS.2015.7169049</a>.","short":"G. Sievers, J. Ax, N. Kucza, M. Flaskamp, T. Jungeblut, W. Kelly, M. Porrmann, U. Rückert, in: 2015 IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, 2015, pp. 1925–1928.","chicago":"Sievers, Gregor, Johannes Ax, Nils Kucza, Martin Flaskamp, Thorsten Jungeblut, Wayne Kelly, Mario Porrmann, and Ulrich Rückert. “Evaluation of Interconnect Fabrics for an Embedded MPSoC in 28 Nm FD-SOI.” In <i>2015 IEEE International Symposium on Circuits and Systems (ISCAS)</i>, 1925–28. IEEE, 2015. <a href=\"https://doi.org/10.1109/ISCAS.2015.7169049\">https://doi.org/10.1109/ISCAS.2015.7169049</a>."},"author":[{"full_name":"Sievers, Gregor","last_name":"Sievers","first_name":"Gregor"},{"last_name":"Ax","full_name":"Ax, Johannes","first_name":"Johannes"},{"full_name":"Kucza, Nils","last_name":"Kucza","first_name":"Nils"},{"full_name":"Flaskamp, Martin","last_name":"Flaskamp","first_name":"Martin"},{"orcid":"0000-0001-7425-8766","full_name":"Jungeblut, Thorsten","last_name":"Jungeblut","first_name":"Thorsten","id":"242294","orcid_put_code_url":"https://api.orcid.org/v2.0/0000-0001-7425-8766/work/157800205"},{"first_name":"Wayne","last_name":"Kelly","full_name":"Kelly, Wayne"},{"first_name":"Mario","full_name":"Porrmann, Mario","last_name":"Porrmann"},{"first_name":"Ulrich","last_name":"Rückert","full_name":"Rückert, Ulrich"}],"language":[{"iso":"eng"}],"year":"2015","_id":"4494","title":"Evaluation of interconnect fabrics for an embedded MPSoC in 28 nm FD-SOI","date_created":"2024-04-16T10:32:24Z","publication":"2015 IEEE International Symposium on Circuits and Systems (ISCAS)","publication_status":"published","user_id":"220548","publication_identifier":{"eisbn":["978-1-4799-8391-9"]},"type":"conference"}]