{"year":"1999","page":"70-74","publication":"Thin Solid Films","publisher":"Elsevier BV","volume":338,"publication_identifier":{"issn":["00406090"]},"status":"public","type":"journal_article","author":[{"full_name":"Hamelmann, Frank","id":"208487","first_name":"Frank","last_name":"Hamelmann"},{"full_name":"Petri, S.H.A.","last_name":"Petri","first_name":"S.H.A."},{"last_name":"Klipp","first_name":"A.","full_name":"Klipp, A."},{"first_name":"G.","last_name":"Haindl","full_name":"Haindl, G."},{"last_name":"Hartwich","first_name":"J.","full_name":"Hartwich, J."},{"full_name":"Dreeskornfeld, L.","first_name":"L.","last_name":"Dreeskornfeld"},{"first_name":"U.","last_name":"Kleineberg","full_name":"Kleineberg, U."},{"full_name":"Jutzi, P.","last_name":"Jutzi","first_name":"P."},{"last_name":"Heinzmann","first_name":"U.","full_name":"Heinzmann, U."}],"date_updated":"2023-09-01T10:22:01Z","date_created":"2023-09-01T10:05:42Z","doi":"10.1016/S0040-6090(98)00996-1","publication_status":"published","intvolume":"       338","user_id":"216459","citation":{"mla":"Hamelmann, Frank, et al. “W/Si Multilayers Deposited by Hot-Filament MOCVD.” <i>Thin Solid Films</i>, vol. 338, no. 1–2, Elsevier BV, 1999, pp. 70–74, doi:<a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">10.1016/S0040-6090(98)00996-1</a>.","ieee":"F. Hamelmann <i>et al.</i>, “W/Si multilayers deposited by hot-filament MOCVD,” <i>Thin Solid Films</i>, vol. 338, no. 1–2, pp. 70–74, 1999.","alphadin":"<span style=\"font-variant:small-caps;\"><span style=\"font-variant:small-caps;\">Hamelmann, Frank</span> ; <span style=\"font-variant:small-caps;\">Petri, S.H.A.</span> ; <span style=\"font-variant:small-caps;\">Klipp, A.</span> ; <span style=\"font-variant:small-caps;\">Haindl, G.</span> ; <span style=\"font-variant:small-caps;\">Hartwich, J.</span> ; <span style=\"font-variant:small-caps;\">Dreeskornfeld, L.</span> ; <span style=\"font-variant:small-caps;\">Kleineberg, U.</span> ; <span style=\"font-variant:small-caps;\">Jutzi, P.</span> ; u. a.</span>: W/Si multilayers deposited by hot-filament MOCVD. In: <i>Thin Solid Films</i> Bd. 338, Elsevier BV (1999), Nr. 1–2, S. 70–74","apa":"Hamelmann, F., Petri, S. H. A., Klipp, A., Haindl, G., Hartwich, J., Dreeskornfeld, L., … Heinzmann, U. (1999). W/Si multilayers deposited by hot-filament MOCVD. <i>Thin Solid Films</i>, <i>338</i>(1–2), 70–74. <a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">https://doi.org/10.1016/S0040-6090(98)00996-1</a>","ama":"Hamelmann F, Petri SHA, Klipp A, et al. W/Si multilayers deposited by hot-filament MOCVD. <i>Thin Solid Films</i>. 1999;338(1-2):70-74. doi:<a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">10.1016/S0040-6090(98)00996-1</a>","bibtex":"@article{Hamelmann_Petri_Klipp_Haindl_Hartwich_Dreeskornfeld_Kleineberg_Jutzi_Heinzmann_1999, title={W/Si multilayers deposited by hot-filament MOCVD}, volume={338}, DOI={<a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">10.1016/S0040-6090(98)00996-1</a>}, number={1–2}, journal={Thin Solid Films}, publisher={Elsevier BV}, author={Hamelmann, Frank and Petri, S.H.A. and Klipp, A. and Haindl, G. and Hartwich, J. and Dreeskornfeld, L. and Kleineberg, U. and Jutzi, P. and Heinzmann, U.}, year={1999}, pages={70–74} }","short":"F. Hamelmann, S.H.A. Petri, A. Klipp, G. Haindl, J. Hartwich, L. Dreeskornfeld, U. Kleineberg, P. Jutzi, U. Heinzmann, Thin Solid Films 338 (1999) 70–74.","chicago":"Hamelmann, Frank, S.H.A. Petri, A. Klipp, G. Haindl, J. Hartwich, L. Dreeskornfeld, U. Kleineberg, P. Jutzi, and U. Heinzmann. “W/Si Multilayers Deposited by Hot-Filament MOCVD.” <i>Thin Solid Films</i> 338, no. 1–2 (1999): 70–74. <a href=\"https://doi.org/10.1016/S0040-6090(98)00996-1\">https://doi.org/10.1016/S0040-6090(98)00996-1</a>."},"issue":"1-2","language":[{"iso":"eng"}],"title":"W/Si multilayers deposited by hot-filament MOCVD","_id":"3553"}