Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers
S. Heitmann, A. Hütten, T. Hempel, W. Schepper, G. Reiss, C. Alof, Journal of Applied Physics 87 (2000) 4849–4851.
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DOI
Artikel
| Veröffentlicht
| Englisch
Autor*in
Heitmann, S.;
Hütten, A.;
Hempel, T.;
Schepper, W.;
Reiss, G.;
Alof, C.
Erscheinungsjahr
Zeitschriftentitel
Journal of Applied Physics
Band
87
Zeitschriftennummer
9
Seite
4849-4851
ISSN
eISSN
FH-PUB-ID
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Heitmann, S. ; Hütten, A. ; Hempel, T. ; Schepper, W. ; Reiss, G. ; Alof, C.: Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. In: Journal of Applied Physics Bd. 87, AIP Publishing (2000), Nr. 9, S. 4849–4851
Heitmann S, Hütten A, Hempel T, Schepper W, Reiss G, Alof C. Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. Journal of Applied Physics. 2000;87(9):4849-4851. doi:10.1063/1.373179
Heitmann, S., Hütten, A., Hempel, T., Schepper, W., Reiss, G., & Alof, C. (2000). Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers. Journal of Applied Physics, 87(9), 4849–4851. https://doi.org/10.1063/1.373179
@article{Heitmann_Hütten_Hempel_Schepper_Reiss_Alof_2000, title={Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers}, volume={87}, DOI={10.1063/1.373179}, number={9}, journal={Journal of Applied Physics}, publisher={AIP Publishing}, author={Heitmann, S. and Hütten, A. and Hempel, T. and Schepper, W. and Reiss, G. and Alof, C.}, year={2000}, pages={4849–4851} }
Heitmann, S., A. Hütten, T. Hempel, W. Schepper, G. Reiss, and C. Alof. “Interplay of Antiferromagnetic Coupling in Copper/Permalloy Combination Multilayers.” Journal of Applied Physics 87, no. 9 (2000): 4849–51. https://doi.org/10.1063/1.373179.
S. Heitmann, A. Hütten, T. Hempel, W. Schepper, G. Reiss, and C. Alof, “Interplay of antiferromagnetic coupling in copper/permalloy combination multilayers,” Journal of Applied Physics, vol. 87, no. 9, pp. 4849–4851, 2000.
Heitmann, S., et al. “Interplay of Antiferromagnetic Coupling in Copper/Permalloy Combination Multilayers.” Journal of Applied Physics, vol. 87, no. 9, AIP Publishing, 2000, pp. 4849–51, doi:10.1063/1.373179.
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