Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget
A. Tharwat, W. Schenck, IEEE Transactions on Knowledge and Data Engineering 36 (2024) 4317–4330.
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Zeitschriftentitel
IEEE Transactions on Knowledge and Data Engineering
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36
Zeitschriftennummer
8
Seite
4317-4330
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Tharwat, Alaa ; Schenck, Wolfram: Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget. In: IEEE Transactions on Knowledge and Data Engineering Bd. 36, Institute of Electrical and Electronics Engineers (IEEE) (2024), Nr. 8, S. 4317–4330
Tharwat A, Schenck W. Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget. IEEE Transactions on Knowledge and Data Engineering. 2024;36(8):4317-4330. doi:10.1109/TKDE.2024.3365189
Tharwat, A., & Schenck, W. (2024). Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget. IEEE Transactions on Knowledge and Data Engineering, 36(8), 4317–4330. https://doi.org/10.1109/TKDE.2024.3365189
@article{Tharwat_Schenck_2024, title={Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget}, volume={36}, DOI={10.1109/TKDE.2024.3365189}, number={8}, journal={IEEE Transactions on Knowledge and Data Engineering}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, author={Tharwat, Alaa and Schenck, Wolfram}, year={2024}, pages={4317–4330} }
Tharwat, Alaa, and Wolfram Schenck. “Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget.” IEEE Transactions on Knowledge and Data Engineering 36, no. 8 (2024): 4317–30. https://doi.org/10.1109/TKDE.2024.3365189.
A. Tharwat and W. Schenck, “Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget,” IEEE Transactions on Knowledge and Data Engineering, vol. 36, no. 8, pp. 4317–4330, 2024.
Tharwat, Alaa, and Wolfram Schenck. “Using Methods From Dimensionality Reduction for Active Learning With Low Query Budget.” IEEE Transactions on Knowledge and Data Engineering, vol. 36, no. 8, Institute of Electrical and Electronics Engineers (IEEE), 2024, pp. 4317–30, doi:10.1109/TKDE.2024.3365189.
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