Optimization of electrowetting electrodes: Analysis of the leakage current characteristics of various dielectric layers
B. Cahill, A.T. Giannitsis, R. Land, G. Gastrock, U. Pliquett, T. Nacke, M. Min, D. Beckmann, in: Institute of Electrical and Electronics Engineers (IEEE) (Ed.), 2008 11th International Biennial Baltic Electronics Conference, IEEE, 2008, pp. 79–82.
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Konferenzbeitrag
| Veröffentlicht
| Englisch
Autor*in
Cahill, Brian
;
Giannitsis, A. T.;
Land, R.;
Gastrock, G.;
Pliquett, U.;
Nacke, T.;
Min, M.;
Beckmann, D.
herausgebende Körperschaft
Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Electrowetting is a phenomenon that has attracted much attention in recent years for application in lab-on-a-chip devices. The electrical control of contact angle can be used to transport liquid droplets by capillary forces. We present experimental work that aims to clarify the role played by the dielectric breakdown of surface coatings. The relation between electrowetting and dielectric breakdown was tested by means of measuring the contact angle of a droplet of water placed between two electrodes on an insulated surface. The current and resistance between these electrodes was measured as a function of applied voltage for the following dielectric coatings: silicon dioxide, silicon nitride and parylene.
Erscheinungsjahr
Titel des Konferenzbandes
2008 11th International Biennial Baltic Electronics Conference
Seite
79-82
Konferenz
2008 International Biennial Baltic Electronics Conference (BEC2008)
Konferenzort
Tallinn
Konferenzdatum
2008-10-06 – 2008-10-08
ISBN
FH-PUB-ID
Zitieren
Cahill, Brian ; Giannitsis, A. T. ; Land, R. ; Gastrock, G. ; Pliquett, U. ; Nacke, T. ; Min, M. ; Beckmann, D.: Optimization of electrowetting electrodes: Analysis of the leakage current characteristics of various dielectric layers. In: Institute of Electrical and Electronics Engineers (IEEE) (Hrsg.): 2008 11th International Biennial Baltic Electronics Conference : IEEE, 2008, S. 79–82
Cahill B, Giannitsis AT, Land R, et al. Optimization of electrowetting electrodes: Analysis of the leakage current characteristics of various dielectric layers. In: Institute of Electrical and Electronics Engineers (IEEE), ed. 2008 11th International Biennial Baltic Electronics Conference. IEEE; 2008:79-82. doi:10.1109/BEC.2008.4657482
Cahill, B., Giannitsis, A. T., Land, R., Gastrock, G., Pliquett, U., Nacke, T., … Beckmann, D. (2008). Optimization of electrowetting electrodes: Analysis of the leakage current characteristics of various dielectric layers. In Institute of Electrical and Electronics Engineers (IEEE) (Ed.), 2008 11th International Biennial Baltic Electronics Conference (pp. 79–82). Tallinn: IEEE. https://doi.org/10.1109/BEC.2008.4657482
@inproceedings{Cahill_Giannitsis_Land_Gastrock_Pliquett_Nacke_Min_Beckmann_2008, title={Optimization of electrowetting electrodes: Analysis of the leakage current characteristics of various dielectric layers}, DOI={10.1109/BEC.2008.4657482}, booktitle={2008 11th International Biennial Baltic Electronics Conference}, publisher={IEEE}, author={Cahill, Brian and Giannitsis, A. T. and Land, R. and Gastrock, G. and Pliquett, U. and Nacke, T. and Min, M. and Beckmann, D.}, editor={Institute of Electrical and Electronics Engineers (IEEE)Editor}, year={2008}, pages={79–82} }
Cahill, Brian, A. T. Giannitsis, R. Land, G. Gastrock, U. Pliquett, T. Nacke, M. Min, and D. Beckmann. “Optimization of Electrowetting Electrodes: Analysis of the Leakage Current Characteristics of Various Dielectric Layers.” In 2008 11th International Biennial Baltic Electronics Conference, edited by Institute of Electrical and Electronics Engineers (IEEE), 79–82. IEEE, 2008. https://doi.org/10.1109/BEC.2008.4657482.
B. Cahill et al., “Optimization of electrowetting electrodes: Analysis of the leakage current characteristics of various dielectric layers,” in 2008 11th International Biennial Baltic Electronics Conference, Tallinn, 2008, pp. 79–82.
Cahill, Brian, et al. “Optimization of Electrowetting Electrodes: Analysis of the Leakage Current Characteristics of Various Dielectric Layers.” 2008 11th International Biennial Baltic Electronics Conference, edited by Institute of Electrical and Electronics Engineers (IEEE), IEEE, 2008, pp. 79–82, doi:10.1109/BEC.2008.4657482.