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S11-183 Simulative investigation of the influence of mold temperature on the filling process and its effect on part quality during injection molding

J. Brikmann, C. Jaroschek, E. Moritzer, in: 2024.

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Kurzbeitrag Konferenz | Englisch
Autor*in
Brikmann, Johannes ; Jaroschek, ChristophFH Bielefeld ; Moritzer, Elmar
Erscheinungsjahr
Konferenz
PPS 2024
Konferenzort
Ferrol, Spanien
Konferenzdatum
2024-09-30 – 2024-10-03
FH-PUB-ID

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Brikmann, Johannes ; Jaroschek, Christoph ; Moritzer, Elmar : S11-183 Simulative investigation of the influence of mold temperature on the filling  process and its effect on part quality during injection molding. In: , 2024
Brikmann J, Jaroschek C, Moritzer E. S11-183 Simulative investigation of the influence of mold temperature on the filling  process and its effect on part quality during injection molding. In: ; 2024.
Brikmann, J., Jaroschek, C., & Moritzer, E. (2024). S11-183 Simulative investigation of the influence of mold temperature on the filling  process and its effect on part quality during injection molding. Presented at the PPS 2024, Ferrol, Spanien.
@inproceedings{Brikmann_Jaroschek_Moritzer_2024, title={S11-183 Simulative investigation of the influence of mold temperature on the filling  process and its effect on part quality during injection molding}, author={Brikmann, Johannes and Jaroschek, Christoph and Moritzer, Elmar }, year={2024} }
Brikmann, Johannes , Christoph Jaroschek, and Elmar Moritzer. “S11-183 Simulative Investigation of the Influence of Mold Temperature on the Filling  Process and Its Effect on Part Quality during Injection Molding,” 2024.
J. Brikmann, C. Jaroschek, and E. Moritzer, “S11-183 Simulative investigation of the influence of mold temperature on the filling  process and its effect on part quality during injection molding,” presented at the PPS 2024, Ferrol, Spanien, 2024.
Brikmann, Johannes, et al. S11-183 Simulative Investigation of the Influence of Mold Temperature on the Filling  Process and Its Effect on Part Quality during Injection Molding. 2024.

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